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Product Description
IH810F is a polyimide (PI) protective film using an organosilicon pressure-sensitive adhesive. It offers excellent adhesion performance and outstanding high-temperature resistance, making it ideal for precision protection applications in demanding thermal processes.
Product Structure
Key Features
• Excellent high-temperature resistance — no adhesive residue after removal
• High instantaneous bond strength with superior sealing performance
• RoHS compliant.
Applications
IH810F is designed for high-temperature masking protection in various encapsulation processes, temporary fixation during high-temperature manufacturing, carrier support and substrate protection during transfer operations, and surface protection where residue-free removal after high-temperature exposure is required.
Technical Specifications
| Property | Value / Specification | Test Method |
| Substrate Thickness (mm) | 0.025 ± 0.003 | Micrometer |
| Total Product Thickness (mm) (excl. release liner) |
0.031 ± 0.005 |
Micrometer |
| Core Inner Diameter (mm) | 77 ± 2 | Vernier Caliper |
| Peel Force (N/25 mm) | ³ 0.4 | GB/T 2792-2014 |
| Tensile Break Strength (kN/m) | ³ 3.5 | GB/T 30776-2014 |
| Elongation at Break (%) | ³ 45 | GB/T 30776-2014 |
| Maximum Service Temperature (°C) | 260 | — |
Storage Conditions
Storage Environment: Keep in original packaging. Store in a cool, dry environment away from direct sunlight, freezing temperatures, and excessive heat.
Shelf Life: 6 months when stored at temperature 15°C–30°C and relative humidity 40%–70%.
Precautions
• Keep the product away from heat sources and open flames.
• The surface to be bonded must be clean, dry, and free of oil or other contaminants.
• As a pressure-sensitive adhesive product, apply sufficient pressure during lamination. Inadequate pressure will adversely affect adhesion performance and appearance.
• Not intended for outdoor use. Outdoor exposure may cause adhesive residue on the substrate upon removal.
