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Bande de Packaing de semi-conducteur
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KHJ TS658M heat Release Tape High-Adhesion High-Temp Acrylic Adhesive Wafer Grinding 200°C+ PET Base Factory Manufacturer OEM Custom

KHJ TS658M heat Release Tape High-Adhesion High-Temp Acrylic Adhesive Wafer Grinding 200°C+ PET Base Factory Manufacturer OEM Custom

Nom De Marque: KHJ
Numéro De Modèle: TS658M
Les informations détaillées
Lieu d'origine:
Chine
Certification:
RoHS
Description de produit
Description TS658M is a white translucent thermal release tape with high initial viscosity. At (150-160℃), The stickiness of the adhesive surface disappears and automatic separation from the object to be adhered can be achieved. Construction Features * Easily peeled off by heat treatment at any time * Initial temperature resistance and will not re-tack * RoHS Compliant Application This product is suitable for temporarily fixing various types of components, ceramics, glass,