logo
Envoyer le message

Détails des produits

Created with Pixso. Maison Created with Pixso. Produits Created with Pixso.
Bande de Packaing de semi-conducteur
Created with Pixso.

KHJ TS651ZF Heat Release Tape Acrylic Adhesive Ultra-Thin Wafer Dicing Delicate Factory Manufacturer

KHJ TS651ZF Heat Release Tape Acrylic Adhesive Ultra-Thin Wafer Dicing Delicate Factory Manufacturer

Nom De Marque: KHJ
Numéro De Modèle: TS651ZF
Les informations détaillées
Lieu d'origine:
Chine
Certification:
RoHS
Description de produit
PRODUCT DESCRIPTION TS651ZF is a white heat-release adhesive tape with high initial tack. It retains adhesion at elevated temperatures until the adhesive foams and loses tack at 190℃, achieving automatic separation from the substrate. Product Structure Product Features * Initial heat resistance; non-re-tacky * High instantaneous adhesion with precise positioning; components are easily removed after heat debonding, leaving no adhesive residue Product Applications Suitable for