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Bande thermique de libération
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DTS641A Double-Sided Heat Release Tape for MLCC Semiconductor Wafer Dicing Backgrinding | High-Adhesion No-Residue Thermal Debonding PET 90-150C | PCB Ceramic Glass LED Cutting Temp Fix Assembly | KHJ

DTS641A Double-Sided Heat Release Tape for MLCC Semiconductor Wafer Dicing Backgrinding | High-Adhesion No-Residue Thermal Debonding PET 90-150C | PCB Ceramic Glass LED Cutting Temp Fix Assembly | KHJ

Nom De Marque: KHJ
Numéro De Modèle: DTS641A
Les informations détaillées
Lieu d'origine:
Chine
Certification:
ROHS、ISO9001
Description de produit
Product Description DTS641A is a double-sided tape with good initial tack. Both sides are covered with foam rubber layers. Under the condition of 110-140 ℃, the viscosity of the foam rubber surface gradually disappears, and it can automatically separate from the adhered objec. Product structure Product features Excellent weather resistance, no re-adhesion Strong instantaneous viscosity, components are easy to remove after thermal viscosity reduction without residual adhesive